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Recent Low Power Design Achievements


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Success Stories

Case1.

Description

?   First 14nm Product

?   High performance DSP

?   Ultra low power methodology, including multi-power domain, multi-voltage

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Application

HPC   DSP

Process

14nm 1P11M

Chip   size

4.2x3.8   sq mm

Gate   count

10M instance

Freq.

>1GHz



Case2.

Description

?   AI Edge usage, 8-core A55 + RISC V core

?   High performance processing units

?   Up to 8 in 1 chiplet package

?   Innovative DFT and physical design method

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Application

AI   Edge

Process

14nm 1P11M

Chip   size

10000um   x 10000um

Gate   count

60M instance

Freq.

>1.5GHz



Case3.

Description

?   First 40nm SOC production

?   ARM A5 core based smart phone solution, high performance for CPU

?   Ultra low power methodology, including multi-power domain, multi-voltage

?   Complex at speed DFT implementation


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Application

Smart   Phone AP + Baseband

Process

40nm 1P7M

Chip   size

4350um   x 4300um

Gate   count

8M instance

Freq.

820MHz



Case4.

Description

?   IP: MIPI csi/dsi, HDMI 2.0, USB 3.0, ADC, AFE, PLL, Efuse, LPDDR2/DDR3/LPDDR3

?   GPU T720 (2 core):  400Mhz

?   Video Codec: 400Mhz

?   A53 (4 core): 825Mhz ( no over-drive)

?   DDR: 800Mhz

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Application

Application   Processor

Process

28nmPS 1P8M

Chip   size

8000um   x 8500um

Gate   count

8M instance

Freq.

>1GHz



Case5.

Description

?   Dual core high performance CPU

?   72bit DDR with ECC

?   Power

?   A53 (4 core): 825Mhz ( no over-drive)

?   A53: use ARM PoP 12T library

?   DDR: 800Mhz

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Application

CPU

Process

40nm 1P9M

Chip   size

9000um   x 10400um

Gate   count

8.5M instance

Freq.

800MHz




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